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Gigabyte ultra durable 4.Gigabyte Ultra Durable AM3+ Series Utilities and Drivers (V2.4)

By admin on July 15, 2021 0 Comments

 

Gigabyte ultra durable 4.GIGABYTE Ultra Durable™ 4 Classic Debuts on GIGABYTE H61 Series Platform

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Item Preview.GALMT-S2PT (rev. /) Overview | Motherboard – GIGABYTE Global

 

GIGABYTE Ultra Durable™ 4 design features 2X the amount of copper of a traditional motherboard for both the Power and Ground layers which dramatically lowers system temperature by delivering a more efficient spreading of heat from critical areas of the motherboard . Sep 03,  · Gigabyte Ultra Durable AM3+ Series Utilities and Drivers (V) by Gigabyte. Publication date Topics Gigabyte, Drivers, Utilities, Bundled Software Discs Language English. Bundled disc with unknown Gigabyte AM3+ motherboard. ISO file is bundled inside zip. Disc Description. GIGABYTE Ultra Durable™ 4 motherboards embrace a range of exclusive features that guarantee DIY PC builders the absolute best protection for their PC, with built-in features that prevent common malfunction threats users encounter on a day-to-day basis.

 

Gigabyte ultra durable 4.GIGABYTE Ultra Durable™ 4 Classic webpage

Aug 30,  · Debuting on the Intel® H61 Express Chipset, GIGABYTE Ultra Durable™ 4 Classic is a range of exciting technologies that safe-guard PCs from common everyday threats, including humidity and moisture, electro-static discharge, sudden power loss and high operating temperatures. GIGABYTE Ultra Durable™ 4 motherboards embrace a range of exclusive features that guarantee DIY PC builders the absolute best protection for their PC, with built-in features that prevent common malfunction threats users encounter on a day-to-day basis. Sep 03,  · Gigabyte Ultra Durable AM3+ Series Utilities and Drivers (V) by Gigabyte. Publication date Topics Gigabyte, Drivers, Utilities, Bundled Software Discs Language English. Bundled disc with unknown Gigabyte AM3+ motherboard. ISO file is bundled inside zip. Disc Description.
 
 
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GA-78LMT-S2PT (rev. 4.0/4.1)
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GIGABYTE Ultra Durable™ 4 Classic Debuts on GIGABYTE H61 Series Platform | News – GIGABYTE Global
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Ultra Durable™ | Motherboard – GIGABYTE Global

High Current Capable Components. Quality Inside and Out. A 2X Copper layer design also provides improved signal quality and lower EMI Electromagnetic Interference , providing better system stability and allowing for greater margins for overclocking.

The layout and packaging use copper connections for all power paths rather than wire bonds, reducing losses due to high resistance wire bonds as well as high inductance which causes ringing and high AC losses. This is another reason the device is so durable and can handle 60A. It is also one of the most expensive components of the power design.

What is a Power Stage? Power Stages are made using a more advanced manufacturing process, and are therefore more efficient. They are less expensive and less efficient than single chip Power Stages.

Results may differ according to system configuration. Each power component has a maximum thermal operational temperature, and once it is reached, adding more voltage will only result in a failed overclock.

Not enough power for overclocking. Copper Layer. High Capacity Ferrite Core Choke. Lower Temperature. Better Overclocking. Better Power Effciency. Better ESD Protection. This is essential to ensure the motherboard is able to handle the increased power loading that is necessary when overclocking.

Good Efficiency Low Temperature. Low Efficiency High Temperature. Japanese Solid Capacitor. Signal Layer. Power Layer. Ground Layer. This offers much better protection from short circuit and system malfunction caused by humid and damp conditions. Electrostatic Protection. Power Failure Protection. BIOS Recovery. Anti-Surge IC. High Temperature Protection. Cap Comparison. All Solid Cap Design. Share the webpage to Facebook and Twitter :.

Any unauthorized use is strictly prohibited. Exclusive Features. Cool Power, Inside and Out. Custom Copper leadframe conducts heat away from the silicon. PWM controller. Single Package Design. Cooler temps.

Solid Capacitor. Power Stage. Lower EMI. Cool Design. Ferrite Core Choke. Humidity Protection. Glass Fabric PCB technology uses a new PCB material which reduces the amount of space between the fiber weave, making it much more difficult for moisture to penetrate compared to traditional motherboard PCBs. Specially selected components make your PC capable of higher temperatures in more extreme conditions, while at the same time preventing your PC from overheating.

Traditional Cap Design.

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